4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Erik J. Roggeman

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active

Barrier for interconnect and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Sacrificial seed layer process for forming C4 solder bumps

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2576676

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