4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Eric Duchesne

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Adjusting fillet geometry to couple a heat spreader to a...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Adjusting fillet geometry to couple a heat spreader to a...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electronically grounded heat spreader

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Flux composition and techniques for use thereof

Metal treatment – Compositions – Fluxing
Reexamination Certificate

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Grounding and thermal dissipation for integrated circuit...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Profile ID: LFUS-PAI-P-1794336

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