Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-02-13
2007-02-13
Smith, Zandra V. (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000, C257SE23101, C438S106000, C438S122000, C438S124000
Reexamination Certificate
active
10665997
ABSTRACT:
Electronically grounded heat spreaders are employed in connection with the dissipation of heat, which is generated by electronic devices, such as semiconductor chips. Also provided is a novel method for the adhesive fastening of metallic heat spreaders to semiconductor chips through the combined use of electrically conductive and non-conductive adhesive materials.
REFERENCES:
patent: 6392890 (2002-05-01), Katchmar
patent: 6489668 (2002-12-01), Oda et al.
patent: 6518660 (2003-02-01), Kwon et al.
patent: 6590292 (2003-07-01), Barber et al.
Duchesne Eric
Gaynes Michael A.
International Business Machine Corporation
Novacek Christy
Smith Zandra V.
Steinberg, Esq. William E.
LandOfFree
Electronically grounded heat spreader does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronically grounded heat spreader, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronically grounded heat spreader will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3864238