4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Electroplating Engineers of Japan Ltd.

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Apparatus for selectively plating rectangular sheet continuously

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent

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Automatic wafer plating equipment

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – Plural treatments
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High speed nickel plating method using insoluble anode

Chemistry: electrical and wave energy – Processes and products
Patent

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Method of preventing deformation of lead frames

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Plating device for wafer

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent

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Profile ID: LFUS-PAI-P-1150869

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