Plating device for wafer

Details Plating device for wafer Plating device for wafer

1993-05-04

1995-07-04

Valentine, Donald R.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204297R, 204297M, 204279, C25D 1706

Patent

active

054297338

ABSTRACT:
A plating device for a wafer employs an air bag 6, 20 as a holding means for downwardly depressing the wafer 8 upon performing plating on the wafer 8. The air bag 6, 20 constrain only the upper surface 13 of the circumferential edge of the wafer at an expanded state and releases the constraint by contracting to restore an initial configuration at a non-expanded state. By this, the holding means will not occupy the upper side space of the wafer both during plating process and during non-plating process so as to avoid adhering of dust and foreign matter onto the wafer 8.

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