Automatic wafer plating equipment

Details Automatic wafer plating equipment Automatic wafer plating equipment

1997-07-28

1999-08-10

Edwards, Laura

Coating apparatus

With heat exchange, drying, or non-coating gas or vapor...

Plural treatments

118407, 118412, 118423, 118428, 118429, 118500, 414222, 414225, 414936, 414938, 414940, 414941, 134902, 134 61, B05C 300

Patent

active

059353309

ABSTRACT:
An automatic wafer plating equipment for automatically plating wafers and more particularly, for automatically plating a small lot of wafers is disclosed. The automatic wafer plating equipment includes a transfer robot provided with a holding arm for pivoting, vertical movement, extending and extracting, a load stage, an orientation stage, a plating stage, a recovery stage, and a cleaning stage. The transfer robot carries out a series of the following operations for plating process. The wafers are picked up one by one from a supply cassette loaded to the load stage. The wafer is then fed to the orientation stage. The wafer orientated at the orientation stage is conveyed to the plating stage. The plated wafer is transferred from the plating stage to the recovery stage. When residue of a plating liquid has been recovered at the recovery stage, the wafer is conveyed to the cleaning stage.

REFERENCES:
patent: 4604027 (1986-08-01), Becker et al.
patent: 5404894 (1995-04-01), Shiraiwa
patent: 5570994 (1996-11-01), Somekh et al.

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