4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Eiji Hagimoto

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active

Chip package device mountable on a mother board in whichever of

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Chip package device mountable on a mother board in whichever of

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Method for manufacturing bump leaded film carrier type semicondu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Method for manufacturing bump leaded film carrier type semicondu

Fishing – trapping – and vermin destroying
Patent

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Profile ID: LFUS-PAI-P-1128208

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