4. Power plants
  5. Motor operated by expansion and/or contraction of a unit of...

Edmund D. Blackshear

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High bandwidth 3D memory packaging technique

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Pre-bond encapsulation of area array terminated chip and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Pre-bond encapsulation of area array terminated chip and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Stirling type cylinder force amplifier

Power plants – Motor operated by expansion and/or contraction of a unit of...
Patent

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Vertically stacked memory chips in FBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1483917

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