4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Donna S. Zupanski-Nielsen

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Inhibition of tin oxide formation in lead free interconnect...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Interconnections for flip-chip using lead-free solders and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Interconnections for flip-chip using lead-free solders and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Method for fabricating last level copper-to-C4 connection...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Structure and method for producing multiple size...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2292252

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