Method for connecting substrate and composite element

Details Method for connecting substrate and composite element Method for connecting substrate and composite element

2008-07-08

2008-07-08

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C257S730000, C257SE23127

Reexamination Certificate

active

10511557

ABSTRACT:
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.

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XP-10232226A-1, Anodic Bonding Technique Under Low-Temperature and Low-Voltage Using Evaporated Glass, Woo-Beom Choi et al., 9thInt'l Vacuum Microelectronics Conference, St. Petersburg 1996, pp. 427-430.
International Preliminary Examination Report dated May 6, 2005.

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