Method for connecting substrate and composite element

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Having enclosed cavity

Reexamination Certificate

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C257S730000, C257SE23127

Reexamination Certificate

active

07396741

ABSTRACT:
A process for joining substrates having electrical, semiconducting, mechanical and/or optical components, and to a composite element is provided. The process is to be suitable for substrates that are to be joined substantially irrespective of material and for sensitive substrates. According to the process, a raised frame, in particular formed from anodically bondable glass, is applied by evaporation coating to one of the two substrates in order to serve as a joining element.

REFERENCES:
patent: 4426768 (1984-01-01), Black et al.
patent: 4802952 (1989-02-01), Kobori et al.
patent: 5343064 (1994-08-01), Spangler et al.
patent: 5895233 (1999-04-01), Higashi et al.
patent: 6969667 (2005-11-01), Liebeskind et al.
patent: 10222609.1 (2002-05-01), None
patent: 10222958.9 (2002-05-01), None
patent: 10222964.3 (2002-05-01), None
patent: 10252787.3 (2002-11-01), None
patent: 10301559.0 (2003-10-01), None
patent: 0 280 905 (1988-09-01), None
XP-10232226A-1, Anodic Bonding Technique Under Low-Temperature and Low-Voltage Using Evaporated Glass, Woo-Beom Choi et al., 9thInt'l Vacuum Microelectronics Conference, St. Petersburg 1996, pp. 427-430.
International Preliminary Examination Report dated May 6, 2005.

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