4. Metal fusion bonding
  5. Process
  6. Plural joints

Dennis E. Cummings

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Interconnection of electronic components

Metal fusion bonding – Process – Plural joints
Patent

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Interconnection of electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Profile ID: LFUS-PAI-P-1292545

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