Interconnection of electronic components

Details Interconnection of electronic components Interconnection of electronic components

1988-02-01

1990-09-11

Heinrich, Sam

Metal fusion bonding

Process

Plural joints

2281802, 228215, 228254, 228 45, 228155, 228175, 29837, 29840, 219 5621, H01L 2160, H01L 21603, B23K10140

Patent

active

049555235

ABSTRACT:
A technique for interconnecting electronic components in which interconnection wires are bonded to contacts on a first component without the use of a material other than the materials of the contacts and the wires; the wires are then severed to a desired length of between 2d and 20d, where d is the diameter of the wires, and bonded to contacts on the second component by means of a conductive material such as solder. Preferably, solder is provided as pools located in recesses in a layer of insulting material. The wire may be bonded to the contact on the first component by means of a wire bonder having a bonding head which weakens or severs the wire to the desired length.

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