4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

Dennis Brian Miller

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Method for forming a microelectronic assembly

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method for forming solder bumps on bond pads

Metal fusion bonding – Process – Preplacing solid filler
Patent

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Microelectronic assembly for connection to an embedded electrica

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Microelectronic assembly with connection to a buried electrical

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Microelectronic assembly with connection to a buried...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-901800

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