Microelectronic assembly for connection to an embedded electrica

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

235492, 343702, 361764, H05K 702, G06K 1907

Patent

active

058569120

ABSTRACT:
A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).

REFERENCES:
patent: 4042861 (1977-08-01), Yasuda et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5128746 (1992-07-01), Pennisi et al.
patent: 5136365 (1992-08-01), Pennisi et al.
patent: 5241133 (1993-08-01), Mullen, III et al.
patent: 5278726 (1994-01-01), Brenardoni et al.
patent: 5285352 (1994-02-01), Pastore et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Microelectronic assembly for connection to an embedded electrica does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic assembly for connection to an embedded electrica, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic assembly for connection to an embedded electrica will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-866744

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.