Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-03-04
1999-01-05
Sparks, Donald
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
235492, 343702, 361764, H05K 702, G06K 1907
Patent
active
058569120
ABSTRACT:
A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26). The leg (20) extends into the via (28) and contacts a conductive body (22) within the via (28). The conductive body (22) electrically connects the leg (20) and the terminal (24).
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Kemper Brian R.
Miller Dennis Brian
O'Malley Grace M.
Fekete Douglas D.
MacIntyre John
Motorola Inc.
Sparks Donald
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