Method for forming solder bumps on bond pads

Details Method for forming solder bumps on bond pads Method for forming solder bumps on bond pads

1996-09-03

1998-11-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

2282481, 438616, H05K 334, H01L 2160

Patent

active

058296689

ABSTRACT:
Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).

REFERENCES:
patent: 4396140 (1983-08-01), Jaffe et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 5217597 (1993-06-01), Moore et al.
patent: 5429293 (1995-07-01), Bradley, III et al.
patent: 5586715 (1996-12-01), Schwiebert et al.
patent: 5643831 (1997-07-01), Ochiai et al.
"BGA Development Update Service, Developments in First Quarter 1996", TechSearch Intenational, Inc., Mar. 1996, pp. 12-15.

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