4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Deepak Nayak

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High performance integrated circuit chip package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Metal-to-metal bonding method and resulting structure

Metal fusion bonding – Process – Chemical reaction produces filler material in situ
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Method for electrically conductive metal-to-metal bonding

Metal fusion bonding – Process – Plural joints
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Method of manufacturing a raised source/drain MOSFET

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Profile ID: LFUS-PAI-P-430292

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