Semiconductor device manufacturing: process – Including control responsive to sensed condition – Interconnecting plural devices on semiconductor substrate
Reexamination Certificate
1992-10-26
2001-08-14
Graybill, David E. (Department: 2814)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
Interconnecting plural devices on semiconductor substrate
C438S025000, C438S027000, C438S031000, C438S059000, C438S063000, C438S065000, C438S071000, C438S072000, C438S116000, C438S121000
Reexamination Certificate
active
06274391
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to the field of packaged integrated circuit devices. More specifically, the present invention relates to a high density interconnect land grid array package (HDIP) having electrical and optical interconnects.
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Mowatt Larry J.
Wachtler Kurt P.
Walter David N.
Brady III Wade James
Graybill David E.
Neerings Ronald O.
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
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