Electric heating – Metal heating – For bonding with pressure
Patent
1990-05-09
1992-04-28
Evans, Geoffrey S.
Electric heating
Metal heating
For bonding with pressure
219 8518, 219233, 228 54, B23K 303
Patent
active
051091470
ABSTRACT:
A small solder tip, which advantageously allows for the rapid production of reliable solder joints without the addition of extra solder, flux or striping the insulation on the wire. The solder tip is preferably formed of tungsten carbide and is used in conjunction with a reflow power supply. In a specific application, the solder tip is utilized for hook-up of magnetic head wires to solder pads. The solder tip comprises a center shaft which allows expanding gases to escape in order to prevent solder from being squeezed out by the pressure build up. The base extremity of the solder tip which contacts the wire is structured with a stepped surface having an opening for accepting the wire therethrough and a projecting leg for contacting the wire and immersing the wire in molten solder. The solder tip additionally comprises a room which provides space for excess solder, enabling the solder tip to accommodate larger variation in solder volume on the pads.
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Applied Magnetics Corporation
Evans Geoffrey S.
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