Alternative to desmear for build-up roughening and copper...

Details Alternative to desmear for build-up roughening and copper... Alternative to desmear for build-up roughening and copper...

2006-06-30

2009-12-29

Clark, Jasmine J (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S753000, C257S762000, C257S773000, C257S711000, C257S775000, C257SE23106, C257SE23160

Reexamination Certificate

active

07638877

ABSTRACT:
In some embodiments, an alternative to desmear for build-up roughening and copper adhesion promotion is presented. In this regard, a substrate in introduced having a dielectric layer, a plurality of polyelectrolyte multilayers on the dielectric layer, and a copper plating layer on the polyelectrolyte multilayers. Other embodiments are also disclosed and claimed.

REFERENCES:
patent: 7081674 (2006-07-01), Ganapathiraman et al.
“pH-Gated Porosity Transitions of Polyelectrolyte Multilayers in Confined Geometries and Their Application as Tunable Bragg Reflectors”, Lei Zhai et al., pp. 6113-6123, vol. 37. No. 16, 2004.
“Ink-Jet Printing, Self—Assembled Polyelectrolytes, and Electroless Plating: Low Cosr Frabrication of Circuits on a Flexible at Room Temperature.”, Kevin Cheng et al., pp. 247-250, 2004.
U.S. Appl. No. 11/441,841, filed May 6, 2006, Nalla, et al.
Mendelsohn, J.D., et al., “Fabrication of Microporous Thin Films from Polyelectrolyte Multilayers”,Langmuir 16:5017-5023, (2000).

Affiliated with

Also associated with

Rating

Alternative to desmear for build-up roughening and copper... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Alternative to desmear for build-up roughening and copper..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Alternative to desmear for build-up roughening and copper... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4072703