4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame

David H. Kinghorn

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Process for preparing solderable integrated circuit lead frames

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent

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Solderable intergrated circuit lead frames plated with tin and p

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-616697

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