4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

David E. Eichstadt

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Barrier for interconnect and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Compliant electrical contacts

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Compliant electrical contacts

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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I/C chip suitable for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Inhibition of tin oxide formation in lead free interconnect...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2367264

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