Metal fusion bonding – Process – Plural joints
Patent
1995-06-05
1998-10-06
Nguyen, Khanh P.
Metal fusion bonding
Process
Plural joints
228203, 228211, 228254, B23K 120, B23K 3102
Patent
active
058164782
ABSTRACT:
A method for flip-chip bonding of two electronic components (27,28) does not use a flux material. A substrate (13) of one electronic component (28) is roughened during processing to provide an improved adhesive surface for a solder ball (12). The roughened pattern is replicated by additional conductive layers formed over the substrate or in an alternate embodiment may be formed on one of the intermediary or top conductive layers. Tacking pressure is applied to the two components so the solder ball (12) will be affixed to the roughened surface and provide a temporary bond. This bond ensures the surfaces of the two electrical components remain in contact with each other during reflow of the solder ball (12) to form a permanent bond.
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Jandzinski David A.
Kaskoun Kenneth
Stafford John W.
Atkins Robert D.
Collopy Daniel R.
Knapp Jeffrey T.
Motorola Inc.
Nguyen Khanh P.
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