Electronic component and method of packaging

Details Electronic component and method of packaging Electronic component and method of packaging

1996-01-11

1997-08-26

Tsai, Jey

Metal working

Method of mechanical manufacture

Electrical device making

29853, 438126, H05K 330

Patent

active

056610882

ABSTRACT:
A method of packaging an electronic component includes forming a hole (24) in a substrate (21) having a first surface (22) opposite a second surface (23) and disposing and patterning a malleable layer (26) over the first surface (22) and over the hole (24) of the substrate (21). The malleable layer (26) has a third surface (27) opposite a fourth surface (28). A portion (29) of the fourth surface (28) is exposed by the hole (24) in the substrate (21). An electrically conductive layer is simultaneously disposed over the portion (29) of the fourth surface (28) and over a different portion of the third surface (27) of the malleable layer (26). The malleable layer (26) is deformed into the hole (24). Then, a semiconductor die (43) is coupled to the malleable layer (26), and an underencapsulant (37) is disposed under the semiconductor die (43) and over the hole (24).

REFERENCES:
patent: 3557446 (1971-01-01), Charschan
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5378869 (1995-01-01), Marrs et al.
patent: 5527741 (1996-06-01), Cole
patent: 5579573 (1996-12-01), Baker
J.W. Wilson, "UV Curable Urethane encapsulant for ceramic chip carriers, IEEE transactions on components . . . " vol. 17, No. 4, pp. 553-558 Dec. 1994.
Translation of JP 07-193098 (Fujitsu) Jul. 1995.

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