4. Coating apparatus
  5. Gas or vapor deposition

Dashun S. Zhou

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Flip chip pre-assembly underfill process

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Utility Patent

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Methods and apparatus for minimizing excess aluminum accumulatio

Coating processes – Interior of hollow article coating – Coating by vapor – gas – mist – or smoke
Patent

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Optical beam splitter

Optical waveguides – With optical coupler – Particular coupling structure
Reexamination Certificate

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Wafer edge deposition elimination

Coating apparatus – Gas or vapor deposition – Having means to expose a portion of a substrate to coating...
Reexamination Certificate

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Wafer edge deposition elimination

Coating apparatus – Gas or vapor deposition
Patent

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Profile ID: LFUS-PAI-P-576456

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