4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Darryl Restaino

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High throughput A1-Cu thin film sputtering process on small cont

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Metal interconnect structure for an integrated circuit with impr

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Method and apparatus for determining wafer warpage for optimized

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field
Patent

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Method for eliminating via resistance shift in organic ILD

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of manufacturing metal interconnect structure for an inte

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-88864

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