Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-05-29
2007-05-29
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C228S180500, C228S056300
Reexamination Certificate
active
11229184
ABSTRACT:
Embodiments of the invention provide a low-melting temperature comprised primarily of a bulk intermetallic phase material. This solder may allow reflow with less of a chance to damage microelectronic devices due to coefficient of thermal expansion mismatches, and may be creep resistant even at high homologous temperatures.
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Andujar Leonardo
Intel Corporation
Jalali Laleh
Soderholm Krista
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