4. Metal fusion bonding
  5. Process
  6. Plural joints

Cynthia Melton

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Method for forming gold bump connection using tin-bismuth solder

Metal fusion bonding – Process – Plural joints
Patent

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Method for forming solder bump interconnections to a solder-plat

Metal fusion bonding – Process – Plural joints
Patent

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Microelectronic package comprising tin copper solder bump...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Microelectronic package comprising tin-copper solder bump interc

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Tin-bismuth solder connection having improved high temperature p

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-1336604

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