4. Plastic article or earthenware shaping or treating: apparatus
  5. Distinct means to feed, support or manipulate preform stock...

Craig S. Mitchell

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Back-face and edge interconnects for lidded package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Encapsulation of microelectronic assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Encapsulation of microelectronic assemblies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Encapsulation of microelectronic assemblies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate

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Image sensor package and fabrication method

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit
Reexamination Certificate

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Profile ID: LFUS-PAI-P-351742

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