4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Compeq Manufacturing Company Limited

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Ball grid array packaging method for an integrated circuit and s

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Detecting structure formed on a PCB to detect unavailability...

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor
Reexamination Certificate

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Flat, built-in resistors and capacitors for a printed...

Electrical resistors – With base extending along resistance element – Resistance element coated on base
Reexamination Certificate

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Method and structure for packaging an integrated circuit with re

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent

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Method for determining the compensation value of the width...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1018432

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