Ball grid array packaging method for an integrated circuit and s

Details Ball grid array packaging method for an integrated circuit and s Ball grid array packaging method for an integrated circuit and s

1997-06-09

1999-03-16

Dutton, Brian

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438613, H01L 2144, H01L 2148, H01L 2150

Patent

active

058829571

ABSTRACT:
A BGA packaging method for an IC includes steps of providing a first dry film to a copper plate, plating nickel-copper to form circuits on one side of the copper plate, providing a second dry film, selectively plating nickel-gold, removing the dry films, providing an insulating layer, providing a back plate, attaching a chip, wire bonding, encapsulating the chip and wires with plastic, etching copper, providing solder resist and attaching solder balls. By this method, a packaged IC with excellent electrical characteristics and heat dissipation can be obtained through a simple procedure.

REFERENCES:
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5663593 (1997-09-01), Mostafazadeh et al.

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