4. Chemistry: electrical and wave energy
  5. Apparatus
  6. Coating, forming or etching by sputtering

Chuong V. Tran

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Dual sputtering source

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
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Gold to gold substrate bonding system utilizing interferometric

Metal fusion bonding – Process – Using only pressure
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Profile ID: LFUS-PAI-P-1260649

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