Dual sputtering source

Details Dual sputtering source Dual sputtering source

1991-12-26

1994-01-18

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20429819, 20429826, C23C 1434

Patent

active

052797244

ABSTRACT:
A compact dual sputtering device which has two adjacent sputtering sections within a housing. The sputtering sections are arranged along a common axis with each section having a ring magnet circumscribed around the axis and a pole magnet, the center of which generally extends along the axis. The ring magnets are axially spaced from each other and the pole magnets are axially spaced from each other with each pole magnet being surrounded by a respective one of the ring magnets leaving a generally annular space between each of the pole magnets and a respective one of the ring magnets. Each section has a target area located on the outer surface of the housing at opposite axial ends of the housing. The housing has fluid inlet means and fluid outlet means and passage means connecting the annular space of one sputtering section with the annular space of the other sputtering section. The fluid inlet means opens into the passage means upstream of fluid flow and the fluid outlet means opens into the passage means downstream of fluid flow so fluid enters the housing through the inlet means and circulates through the passage means and the annular spaces and out of the housing through the outlet means.

REFERENCES:
patent: 3616451 (1971-10-01), Gallez
patent: 3756939 (1973-09-01), Hurwitt
patent: 3779885 (1973-12-01), Labedan et al.
patent: 4401539 (1983-08-01), Abe et al.
patent: 4411763 (1983-10-01), Itaba et al.
patent: 4434042 (1984-02-01), Keith

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