Gold to gold substrate bonding system utilizing interferometric

Details Gold to gold substrate bonding system utilizing interferometric Gold to gold substrate bonding system utilizing interferometric

1994-09-20

1996-06-25

Ramsey, Kenneth J.

Metal fusion bonding

Process

Using only pressure

2282351, 228 443, B23K 2002

Patent

active

055292380

ABSTRACT:
A bonding system with interferometric inspection for real time planarity feedback and control is used to bond two substrates at atmospheric pressure. The interferometric vision system includes a crt monitor display to display the relative planarity between two objects to be bonded. If the planarity is not sufficient, the operator, based on the information displayed, may make infitesimal adjustments to the bonding system to improve the planarity. After the desirable planarity is achieved, a heat system is activated to further facilitate bonding.

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patent: 5046656 (1991-09-01), Schmitt et al.
patent: 5425491 (1995-06-01), Tanaka et al.
patent: 5473433 (1995-12-01), Miller

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