4. Metal treatment
  5. Process of modifying or maintaining internal physical...
  6. Surface melting

Christophe Detavernier

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Eliminating metal-rich silicides using an amorphous Ni alloy...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Metal carbide gate structure and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Metal carbide gate structure and method of fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Reexamination Certificate

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Retarding agglomeration of Ni monosilicide using Ni alloys

Metal treatment – Process of modifying or maintaining internal physical... – Surface melting
Reexamination Certificate

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Retarding agglomeration of Ni monosilicide using Ni alloys

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2898052

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