4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Christian Schuster

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Crosstalk reduction in electrical interconnects using...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Impedance matching circuit with simultaneous shielding of...

Optical communications – Optical transceiver
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Method and structure for controlled impedance wire bonds...

Metal fusion bonding – Process – Plural joints
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Method and structure for controlled impedance wire bonds...

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Printed circuit board via with radio frequency absorber

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-2286703

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