Method and structure for controlled impedance wire bonds...

Details Method and structure for controlled impedance wire bonds... Method and structure for controlled impedance wire bonds...

2007-12-04

2007-12-04

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

10722432

ABSTRACT:
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

REFERENCES:
patent: 3840169 (1974-10-01), Steranko et al.
patent: 4527135 (1985-07-01), Piper
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4602338 (1986-07-01), Cook
patent: 4686492 (1987-08-01), Grellmann et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5477083 (1995-12-01), Kawai
patent: 5768776 (1998-06-01), Pendse
patent: 6084295 (2000-07-01), Horiuchi et al.
patent: 6534854 (2003-03-01), Fazelpour et al.
patent: 6576983 (2003-06-01), Fazelpour et al.
patent: 2001/0015490 (2001-08-01), Lee
patent: 2004/0182911 (2004-09-01), Chia et al.
U.S. Appl. No. 10/241,403, filed Sep. 11, 2002, Opryske et al.

Affiliated with

Also associated with

Rating

Method and structure for controlled impedance wire bonds... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and structure for controlled impedance wire bonds..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and structure for controlled impedance wire bonds... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3842943