Method and structure for controlled impedance wire bonds...

Details Method and structure for controlled impedance wire bonds... Method and structure for controlled impedance wire bonds...

2007-10-24

2010-12-21

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

Reexamination Certificate

active

07854368

ABSTRACT:
A method (and structure) of making an electronic interconnection, includes, for a signal line to be interconnected, using a plurality of bonding wires configured to provide a controlled impedance effect.

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Translation of JP-2002-100842A.
U.S. Appl. No. 10/241,403, Opryske, et al.

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