4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Incoherent light emitter structure
  6. With housing or contact structure

Ching-Wen Tung

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Flip-chip packaging method for light emitting diode with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Flip-chip packaging structure for light emitting diode and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3149822

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