4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Chih Hsien Lin

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Method for forming a multi-layer low-K dual damascene

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of mounting an art sheet

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Method to fabricate high reliable metal capacitor within...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Method to fabricate high reliable metal capacitor within...

Semiconductor device manufacturing: process – Making passive device – Stacked capacitor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1511240

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