4. Measuring and testing
  5. Fluid pressure gauge
  6. Electrical

Chi Kuen Vincent Leung

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Bonding method for through-silicon-via based 3D wafer stacking

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Multi-chip package

Measuring and testing – Fluid pressure gauge – Electrical
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Chi Kuen Vincent Leung does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Chi Kuen Vincent Leung, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chi Kuen Vincent Leung will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-3289268

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure