Multi-chip package

Details Multi-chip package Multi-chip package

2008-05-29

2010-11-16

Allen, Andre J (Department: 2855)

Measuring and testing

Fluid pressure gauge

Electrical

Reexamination Certificate

active

07832278

ABSTRACT:
Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.

REFERENCES:
patent: 4838089 (1989-06-01), Okada et al.
patent: 4916413 (1990-04-01), Nakayama et al.
patent: 5101665 (1992-04-01), Mizuno
patent: 5327104 (1994-07-01), Kikushima
patent: 5577319 (1996-11-01), Knecht
patent: 5608359 (1997-03-01), Knecht et al.
patent: 5859759 (1999-01-01), Moriyama et al.
patent: 5948991 (1999-09-01), Nomura et al.
patent: 6281578 (2001-08-01), Lo et al.
patent: 6294406 (2001-09-01), Bertin et al.
patent: 6534711 (2003-03-01), Pollack
patent: 6546982 (2003-04-01), Brown et al.
patent: 6611434 (2003-08-01), Lo et al.
patent: 6891239 (2005-05-01), Anderson et al.
patent: 6927482 (2005-08-01), Kim et al.
patent: 2004/0113275 (2004-06-01), Karnezos
patent: 2004/0119153 (2004-06-01), Karnezos
patent: 2004/0259288 (2004-12-01), Mostafazadeh et al.
patent: 2007/0278632 (2007-12-01), Zhao et al.
patent: 2008/0012110 (2008-01-01), Chong et al.
patent: 2008/0050859 (2008-02-01), Wallace
patent: 2008/0157311 (2008-07-01), Smith
patent: 2008/0277772 (2008-11-01), Groenhuis et al.
patent: 2008/0290486 (2008-11-01), Chen et al.

Affiliated with

Also associated with

Rating

Multi-chip package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-chip package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4224564