4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Charles-Wee-Ming Lee

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Method of assembling a semiconductor device package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Package for at least one semiconductor body

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2084183

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