Method of assembling a semiconductor device package

Details Method of assembling a semiconductor device package Method of assembling a semiconductor device package

2005-02-08

2005-02-08

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C438S123000, C438S124000, C438S127000, C257S666000, C257S788000, C257S790000

Reexamination Certificate

active

06852567

ABSTRACT:
A method of assembling a semiconductor device package includes first attaching a semiconductor device to a die-pad area of a leadframe. Electrical connections are then between electrical contact areas on the semiconductor device and electrical connection areas on the leadframe to form a device/leadframe assembly. An adhesion enhancing coating is then deposited on the exposed surface of the device frame/leadframe assembly before encapsulating the coated device leadframe assembly in an electrically insulating material.

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