Charles S. Korman

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Direct stacked and flip chip power semiconductor device structur

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Half bridge device package, packaged devices and circuits

Electric power conversion systems – Current conversion – Integrated circuit
Patent

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High density interconnect multi-chip modules including embedded

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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High frequency, high density, low profile, magnetic circuit comp

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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High power factor, voltage-doubler rectifier

Electric power conversion systems – Current conversion – Including an a.c.-d.c.-a.c. converter
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Profile ID: LFUS-PAI-P-134041

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