Lead-free solder process

Details Lead-free solder process Lead-free solder process

1998-04-02

2000-01-04

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2281801, 22818021, 2282481, H05K 334

Patent

active

060100605

ABSTRACT:
A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.

REFERENCES:
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5328660 (1994-07-01), Gonya et al.
patent: 5520752 (1996-05-01), Lucey, Jr. et al.
patent: 5580520 (1996-12-01), Slattery et al.
patent: 5762866 (1998-06-01), Jin et al.

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