4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with coating step

Charles Brantley

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Angularly offset and recessed stacked die multichip device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Angularly offset stacked die multichip device and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Apparatus for coating of a semiconductor wafer

Coating apparatus – With means to centrifuge work
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Chemical dispensing system for semiconductor wafer processing

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – For liquid etchant
Reexamination Certificate

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Circuit and method for contact pad isolation

Electronic digital logic circuitry – With test facilitating feature
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2017307

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