Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Inventor
active
Bump structure with dopants
Flip-chip bonding structure on substrate for flip-chip...
Method of fabricating solder bumps with high coplanarity for...
Semiconductor device and fabrication method thereof
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Profile ID: LFUS-PAI-P-2493092