Optical modulator module package using flip-chip mounting...

Details Optical modulator module package using flip-chip mounting... Optical modulator module package using flip-chip mounting...

2008-07-01

2008-07-01

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S434000, C257S457000, C257S469000, C359S010000

Reexamination Certificate

active

11347187

ABSTRACT:
Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

REFERENCES:
patent: 6303986 (2001-10-01), Shook
patent: 6872984 (2005-03-01), Leung
patent: 7098535 (2006-08-01), Lee et al.
patent: 7102240 (2006-09-01), Park et al.
patent: 7227267 (2007-06-01), Lee et al.

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