4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Insulative housing or support

Chan Ik Park

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Method of making an assembly package having an air tight cavity

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Method of making an assembly package in an air tight cavity and

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-705216

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